IC SUBSTRATE

Copper Plating Additives and Electrolytes for Advanced IC Substrates

Copper Plating Additives and Electrolytes

MLI’s line of solutions for integrated circuit (IC) substrate applications includes accelerator, suppressor and leveler additives, with electrolyte available.

Our unique organic additives bring you higher yields and improved capability through:

  • Superior plating uniformity
  • Low defectivity

Quality, Value, and Technology

Moses Lake Industries’ unique in-house production processes enable us to produce high-purity solutions at competitive costs. Do you need to speak to an expert, or get a product sheet, sample, or quote?

Contact Us!