ADVANCED PACKAGING

Copper TSV, RDL, bump, and grain engineering applications

Copper Plating Additives and Electrolytes

MLI’s line of solutions for advanced packaging includes accelerator, suppressor and leveler additives, with electrolyte available for applications in:

  • Through Silicon Via (TSV)
  • Redistribution Layer (RDL)
  • Bump
  • Grain engineering for enhanced material properties

Our unique organic additives bring you higher yields and improved capability through:

  • Fast fill rates
  • Low defectivity
  • High deposit purity
  • Superior plating uniformity
  • Customized formulations optimized for unique needs/applications

Quality, Value, and Technology

Moses Lake Industries’ unique in-house production processes enable us to produce high-purity solutions at competitive costs. Do you need to speak to an expert, or get a product sheet, sample, or quote?

Contact Us!