May 5, 2026 – Silicon Valley, CA – Moses Lake Industries (MLI) proudly participated in the grand opening of the US-JOINT R&D center in Silicon Valley, California, celebrating the full-scale launch of a first-of-its-kind consortium that MLI has been part of since its founding two years ago. The inauguration ceremony brought together government officials and industry leaders from both the United States and Japan to mark the beginning of active operations at the center, which is dedicated to accelerating next-generation semiconductor packaging technologies.
US-JOINT, led by Resonac Corporation, unites 12 Japanese and U.S. materials and equipment manufacturers in a shared mission: to dramatically shorten the time from concept to commercial-ready packaging technology. The location was chosen for its proximity to major hyperscalers and advanced semiconductor end-users in the heart of Silicon Valley, enabling real-time collaboration that the consortium expects will compress proof-of-concept timelines from roughly six months to as little as one month.
“Two years ago, we believed that the best way to move the semiconductor packaging industry forward was through deep, hands-on collaboration between the world’s leading materials and equipment companies. Seeing the US-JOINT center open its doors today brings that vision to life,” said Hiro Era, CEO of MLI. “We’re excited to work alongside industry leaders in the U.S. and Japan and to see how this model of collaboration drives meaningful innovation across the semiconductor ecosystem.”
The opening follows two years of foundational work by MLI and its consortium partners to stand up the center’s operations, establish research protocols, and build collaborative frameworks across participating companies. With the facility now fully operational, the consortium will begin active proof-of-concept projects spanning advanced materials, packaging evaluation methods, and integration technologies tailored to the needs of AI and high-performance computing applications.
The ceremony drew senior voices from across the industry.
Dilip Vijay, Vice President and Head of Global IC Operations at Broadcom, stated: “A collaborative effort like US-JOINT is exactly what the industry has needed. I am very much looking forward to the US-JOINT R&D center’s full-scale operation in Silicon Valley. We expect this initiative to speed up semiconductor innovation and spark entirely new breakthroughs beyond what we see today.”
Raja Swaminathan, Vice President of Heterogeneous Integration Technologies at AMD, said: “With US-JOINT now fully operational in Silicon Valley, we expect face-to-face technical dialogue to lead to more efficient joint development through faster feedback and clearer understandings. We welcome US-JOINT’s efforts and look forward to the innovations and strengthened ecosystem collaboration this initiative can enable.”
Kazumi Nishikawa, Director-General for Economic Security Policy, Trade and Economic Security Bureau, Japan’s Ministry of Economy, Trade and Industry, remarked: “The expansion of generative AI and the current requirements of computing demands more advanced packaging. I am very confident that US-JOINT is just the start of innovation for advanced packaging and chiplets in generative AI computing. Finally, I truly appreciate the effort that led to today, and I hope that today’s one step can lead to a tremendous outcome for the U.S. and Japan and to the world.”
MLI has been a member of US-JOINT since the consortium’s formation in July 2024 and will continue contributing its specialty materials expertise, including copper electroplating technologies, to concept validation and co-development activities at the center.